JPH0186243U - - Google Patents
Info
- Publication number
- JPH0186243U JPH0186243U JP18309087U JP18309087U JPH0186243U JP H0186243 U JPH0186243 U JP H0186243U JP 18309087 U JP18309087 U JP 18309087U JP 18309087 U JP18309087 U JP 18309087U JP H0186243 U JPH0186243 U JP H0186243U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- thermocouple
- sealing
- resin
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309087U JPH0186243U (en]) | 1987-11-30 | 1987-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18309087U JPH0186243U (en]) | 1987-11-30 | 1987-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0186243U true JPH0186243U (en]) | 1989-06-07 |
Family
ID=31474523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18309087U Pending JPH0186243U (en]) | 1987-11-30 | 1987-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0186243U (en]) |
-
1987
- 1987-11-30 JP JP18309087U patent/JPH0186243U/ja active Pending